Hotline

+8613312905470

Reflow Ovens

Products

High-end PCB Reflow Oven for SMT Line
High-end PCB Reflow Oven for SMT Line
High-end PCB Reflow Oven for SMT Line
High-end PCB Reflow Oven for SMT Line
1. Control System
Computer or Instrument control, make sure machine working steadily.

2. Hot Air Heating System
Both top and bottom zones hot air heating, good heater compensatory,High thermal efficiency, energy saving, speedy heating, suitable for soldering components like BGA,CSP etc.Special forced hot air circulation structure makes PCB and components heat evenly, Temperature Accuracy ± 1.5 °C, room temperature settling time less than 20 minutes.

3. Cooling System
Independent cooling area ensures the low temperature when PCB comes out.

4. Transmission system
Use imported motors, speed adjuster, smoothly running, adjustable speed at 0-2000mm/min.

Consulting

Skype +8613312905470

Details

Specification of High-end PCB Reflow Oven for SMT Line:     (All non-standard product tin furnaces can be customized)

 

 

Model

H6645PC-FL

H8845PC-FL-C1

H1035PC-FL

Dimension(L*W*H)mm

3800*1300*1550mm

4800*1200*1550mm

6000*1200*1550mm

Power Supply

380/220V  50/60Hz

380/220V  50/60Hz

380/220V  50/60Hz

Quantity of preheating zones

6

8

10

startup power

Approx  36KW

Approx  50KW

Approx  85KW

Operation Power

Approx  7KW

Approx  10KW

Approx  12KW

Control System

PC+PLC

PC+PLC

PC+PLC

Preheating Temp

(Room Temperature) - 350

(Room Temperature) - 350

(Room Temperature) - 350

PCB Width(mm)

50-350mm

50-350mm

50-350mm

Machine Weight(kg)

Approx 1200kg

Approx 2000kg

Approx 2200kg

Transmission Agent

Chain+Mess

Chain+Mess

Chain+Mess

Quantity of cooling zones

1

1

2

Conveyor Height

900+/-30mm

900+/-30mm

900+/-30mm

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