Products
Computer or Instrument control, make sure machine working steadily.
2. Hot Air Heating System
Both top and bottom zones hot air heating, good heater compensatory,High thermal efficiency, energy saving, speedy heating, suitable for soldering components like BGA,CSP etc.Special forced hot air circulation structure makes PCB and components heat evenly, Temperature Accuracy ± 1.5 °C, room temperature settling time less than 20 minutes.
3. Cooling System
Independent cooling area ensures the low temperature when PCB comes out.
4. Transmission system
Use imported motors, speed adjuster, smoothly running, adjustable speed at 0-2000mm/min.
Details
Specification of High-end PCB Reflow Oven for SMT Line: (All non-standard product tin furnaces can be customized)
Model |
H6645PC-FL |
H8845PC-FL-C1 |
H1035PC-FL |
Dimension(L*W*H)mm |
3800*1300*1550mm |
4800*1200*1550mm |
6000*1200*1550mm |
Power Supply |
380/220V 50/60Hz |
380/220V 50/60Hz |
380/220V 50/60Hz |
Quantity of preheating zones |
6 |
8 |
10 |
startup power |
Approx 36KW |
Approx 50KW |
Approx 85KW |
Operation Power |
Approx 7KW |
Approx 10KW |
Approx 12KW |
Control System |
PC+PLC |
PC+PLC |
PC+PLC |
Preheating Temp |
(Room Temperature) - 350℃ |
(Room Temperature) - 350℃ |
(Room Temperature) - 350℃ |
PCB Width(mm) |
50-350mm |
50-350mm |
50-350mm |
Machine Weight(kg) |
Approx 1200kg |
Approx 2000kg |
Approx 2200kg |
Transmission Agent |
Chain+Mess |
Chain+Mess |
Chain+Mess |
Quantity of cooling zones |
1 |
1 |
2 |
Conveyor Height |
900+/-30mm |
900+/-30mm |
900+/-30mm |